Copper-phosphorus solder wrapped Copper-phosphorus solder wrapped Composition (%): Ag: - % Cu: 86 % P: 6,5 % others: Sn 6.5% , Si 0.2% Melting point range: 635-675 oC Working temperature: 675 oC Characteristics: Wrapped form of INSTALFIT PLUS solder. Ideal for soldering copper to brass, as there is no need to use additional flux.