CYNA WITH TOPIC in a vial of CYNEL brand 1mm 3mb

PROFESSIONAL TIN IN FIELD WITH TOPIC for soldering of CYNEL brand 1,00 mm 3mb : S-Sn60Pb40 alloy produced in the first melt of tin and lead in accordance with PN EN 29453:2000 , in a continuous casting process without air , then extruded , which ensures the elimination of the occurrence of oxides . S-Sn60Pb40 solder filler mainly applies in the electronics industry, for the manufacture of standard electronic devices and components, electrical engineering and for soldering components with tin coatingsS-Sn60Pb40 alloy is produced in the first melt of tin and lead in accordance with PN EN 29453:2000 standard, in a continuous casting process without air, then extruded, which ensures elimination of the occurrence of oxides. S-Sn60Pb40 solder binder is mainly used in the electronics industry , for the production of standard electronic devices and components , electrical engineering and for soldering components with tin , tin-lead , cadmium , zinc and silver plating . , tin-lead , cadmium , zinc and silver plating . LC60 SW26 core wire dedicated for DIY, small repairs, in household, etc. PARAMETERS: - Tin content: 59.5% ~ 60.5% - Lead content: other - Minimum purity of raw materials used: 99.9% - Melting point: 183 ~ 190°C - Operating temperature: 320 ~ 420°C - Diameter: 1.0mm PROFESSIONAL TIN IN FIELD WITH TOPIC for soldering of CYNEL brand 1,00 mm 3mb : S-Sn60Pb40 alloy produced in the first melt of tin and lead in accordance with PN EN 29453:2000 , in a continuous casting process without air , then extruded , which ensures the elimination of the occurrence of oxides . S-Sn60Pb40 solder filler mainly applies in the electronics industry, for the manufacture of standard electronic devices and components, electrical engineering and for soldering components with tin coatingsS-Sn60Pb40 alloy is produced in the first melt of tin and lead in accordance with PN EN 29453:2000 standard, in a continuous casting process without air, then extruded, which ensures elimination of the occurrence of oxides. Solder binder S-Sn60Pb40 is mainly used in the electronics industry , for the production of standard electronic devices and components , electrical engineering and for soldering components with tin , tin-lead , cadmium , zinc and silver plating . , tin-lead , cadmium , zinc and silver plating . LC60 SW26 core wire dedicated for DIY, small repairs, in household, etc. PARAMETERS: - Tin content: 59.5% ~ 60.5% - Lead content: other - Minimum purity of raw materials used: 99.9% - Melting point: 183 ~ 190°C - Operating temperature: 320 ~ 420°C - Diameter: 1.0mm