TLP-1 COPPER-PHOSPHORUS SOLDER FLUX

TLP-1 COPPER-PHOSPHORUS SOLDER FLUX Activity temperature range: 550-800 oC Characteristics: Flux in powder form, recommended for soldering ferrous as well as non-ferrous metals. Usually used where joint dimensions require long heating time. Used most often for soldering copper and its alloys with copper-phosphorus solders and silver solders with low silver content (less than 30%). Flux residues are corrosive, water-soluble and easily removed